Overview:

In recent years, inspired by the success of Huawei and HiSilicon, Chinese OEMs OPPO, vivo and Xiaomi (OVM) have started to invest in chip development, targeting a commensurate breakthrough in the premium smartphone segment. However, Huawei and HiSilicon’s success is built on their long-term efforts in semiconductor R&D starting in 1991, when Huawei set up its first IC design center. To date, despite the heavy investments in the development and marketing of in-house chips, OVM continues to face headwinds in penetrating the premium smartphone segment.  

This report analyses the differences between OVM’s chip-development strategies, the gap of these players compared to Huawei and HiSilicon, and the opportunities and challenges ahead for their future development.

Table of Contents:

• Introduction
• Section 1: Investments in Chip Development — A Bold Move
• Section 2: Continuing the Investment?
• Section 3: How Difficult it is to Copy the Success of Huawei and HiSilicon?
• Section 4: Potential Benefits and Opportunities
• Conclusion

Number of Pages: 19

Published Date: January 2023