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Component Tracker > Teardown and BOM

BoM Analysis for Asus Zenfone 8 Flip

Oct 11, 2021 | Author : Yasasvi Jayachandra Kuppa, Ethan Qi

Overview:

The report is an extended analysis of the Bill of Materials covering the components that constitute Zenfone 8 flip. This will help in understanding the cost structure and the Components used in the Smartphone with the iconic flip camera mechanism.

Table of Contents: 

  • Key components
  • Components costs
  • Components suppliers
  • Profit margin analysis.

Published Date:  October 2021

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